COM Express Type6 Module ECM-C114
The ECM-C114 is a COM-Express Type 6 Compact core built on the 11th Gen Intel Tiger Lake-U platform.Featuring a 95×95mm footprint and DDR4 memory technology,it integrates graphics Iris Xe integrated graphics and flexible display solutions,delivering a compact high-performance platform for industrial automation and edge vision computing.
Product Features
- Equipped with 11th Gen Intel Tiger Lake-U processors(i3-1115G4 / i5-1135G7 / i7-1165G7)
- COM-Express Type 6 Compact form factor,compact dimension of 95×95mm
- Dual-channel DDR4 3200MHz,up to 64GB,2×SO-DIMM
- Intel Iris Xe integrated graphics + 3×DDI configurable for HDMI/DVI/DP + eDP/LVDS for flexible display solution
- 2×PCIe x4 + 1×PCIe x1 expansion + Intel i211-AT Gigabit Ethernet
- 4×USB3.0 + 8×USB2.0 + 2×SATA3.0 + 8-bit GPIO + TPM2.0
- Wide temperature: 0~60℃ operating / -40~85℃ storage
- Supports Win10 LTSC / Red Hat 8.4 / Ubuntu 20.04
The ECM-C114 core board is equipped with 11th Gen Intel Tiger Lake-U series processors.Options include i3-1115G4(2 cores/4 threads,up to 4.1GHz),i5-1135G7(4 cores/8 threads,up to 4.2GHz) or i7-1165G7(4 cores/8 threads,up to 4.7GHz),all with 28W TDP.Adopting COM-Express Type 6 Compact form and a compact 95×95mm footprint,it balances performance and space efficiency.
It features dual-channel DDR4 3200MHz SO-DIMM memory,up to 64GB via 2×SO-DIMM sockets.Integrated with Intel Iris Xe integrated graphics,the display outputs offer 3×DDI(configurable for HDMI/DVI/DP) + 1×eDP to LVDS converter(eDP optional).Max resolution:HDMI up to 4096×2304@24Hz,DP/eDP up to 4096×2304@60Hz,VGA up to 2048×1536@50Hz.For expansion,it provides 2×PCIe x4 + 1×PCIe x1,and ues Intel i211-AT Gigabit Ethernet controller.
Interface configuration:4×USB3.0,8×USB2.0,2×SATA3.0,1×HDA,2×SER,8-bit GPIO,1×I2C,1×SMBUS,watchdog timer and TPM2.0 security chip.It supports ATX/AT dual power supply.Operating temperature: 0~60℃,storage temperature: -40~85℃.Compatible with Windows 10 LTSC,Red Hat 8.4,Ubuntu 20.04,Yocto 4.0x.Widely deployed in industrial automation,machine vision,digital signage,medical imaging,edge AI and other applicatons.
| ECM-C114 | |
| Product Type | COM-Express Type 6 Compact Core Board |
| Size | 95×95mm |
| Processor | 11th Gen Intel Tiger Lake-U i3-1115G4(2C/4T,4.1GHz)/ i5-1135G7(4C/8T,4.2GHz)/ i7-1165G7(4C/8T,4.7GHz),28W TDP |
| Chipset | SoC |
| Memory Spec | DDR4 3200MHz |
| Max Memory Capacity | 64GB |
| Memory Socket | 2×SO-DIMM |
| Integrated Graphics | Intel Iris Xe |
| PCIe Expansion | 2×PCIe x4 + 1×PCIe x1 |
| Display Output | 3×DDI(HDMI/DVI/DP) + eDP/LVDS(eDP optional);HDMI up to 4096×2304@24Hz；DP/eDP up to 4096×2304@60Hz；VGA up to 2048×1536@50Hz |
| USB Interface | 4×USB3.0；8×USB2.0 |
| Sericl Port | 2×SER |
| Network Interface | 1×Gigabit Etherent(Intel i211-AT) |
| SATA Interface | 2×SATA3.0 |
| Audio | 1×HDA |
| GPIO | 8-bit GPIO |
| Watchdog | Supported |
| TPM | TPM2.0 |
| Power Input | ATX/AT |
| Operating Temperature | 0~60℃ |
| Storage Tmperature | -40~85℃ |
| Operating System | Windows 10 LTSC / Red Hat 8.4 / Ubuntu 20.04 / Yocto 4.0x |
8.ZRT.80-1645-02-LEF(ECM-C114_V10,i5-1135G7,Dual SO-DIMM Sockets,Heatsink,LVDS,Pack of 20,Version V00)
8.ZRT.80-1645-03-LEF(ECM-C114_V10,i3-1115G4,Dual SO-DIMM,Heatsink,LVDS,Pack of 20,Version V00)
Technical Documentation
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- 400-838-6869
- 21st Floor, Tower A, Country Garden Phoenix Intelligent Valley, Baoan District, Shenzhen
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